CHOMERICS CHO-BOND® 4660 Conductive Caulk/Sealant
Subcategory: Thermoset; Polymer
Material Notes: CHO-BOND® 4660 caulking compound is a single-component, electrically conductive, paste-like material intended for EMI shielding and grounding applications. Its non-hardening characteristic makes it particularly suited for shielding joints and seams which are likely to be disassembled, or joints subject to vibrations, warping, or temperature induced displacement.Information provided by Chomerics
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- Density
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- Volatile Organic Compounds (VOC) Content
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- Maximum Service Temperature, Air
- Minimum Service Temperature, Air
- Cure Time
- Shelf Life
- Binder
- Consistency
- Coverage (cm^2 / g)
- Filler
- Mix Ratio
- Working Life hr.
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Property Data |
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