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Cytec (Conap) EN-2523 Potting and Encapsulation Adhesive

 

Subcategory: Adhesive; Polyurethane, TS; Thermoset

Material Notes:

Polyurethane Potting and Encapsulating Systems
Conathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many specific potting and encapsulating applications such as modules, strain-sensitive components, transformers, and coils. All 2500 series systems exhibit excellent performance when exposed to adverse environments and temperature ranges between -55°C and +130°C.

Cytec (Conap) EN-2523 Potting and Encapsulation Adhesive

  • Passes Thermal Shock Test (10 Cycles, -65°C to 130°C)
  • Non-Nutrient Fungus Resistance (MIL-STD-810B)
  • Mix Ratio: 20/100 (by Weight)

Available Properties
  • Density
  • Water Absorption
  • Water Absorption at Saturation
  • Viscosity
  • Linear Mold Shrinkage
  • Hardness, Shore D
  • Tensile Strength, Ultimate
  • Elongation at Break
  • Volume Resistivity
  • Surface Resistance
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • Arc Resistance
  • CTE, linear 20°C
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Cure Time
  • Pot Life
  • Color
  
Property Data

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