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Cytec (Conap) FR-1047 / EA-117 Conapoxy® Resin / Conacure® Hardener

 

Subcategory: Epoxy; Adhesive; Thermoset

Material Notes:

Epoxy Potting and Encapsulating Systems for Electronic Applications
High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.

Cytec (Conap) FR-1047 / EA-117 Conapoxy® Resin / Conacure® Hardener
Flame retardant (UL 94V-0), filled, non-abrasive casting system with excellent thermal shock resistance, low exotherm, very good arc resistance, and high heat distortion properties.

  • Mix Ratio, Resin/Hardener (by weight): 100/7
Cure Type: Elevated Temperature

Available Properties
  • Viscosity
  • Hardness, Shore D
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • Maximum Service Temperature, Air
  • Cure Time
  • Pot Life
  
Property Data

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