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Cookson Group STAYSTIK® 872 Alumina Filled "Low Flow" Dielectric Film

 

Subcategory: Adhesive; Thermoset; Polymer

Material Notes:
These thermoplastic adhesive films are designed for use in a variety of electronic applications. These materials are characterized by their excellent bonding at low process temperatures and extremely low ELASTIC MODULUS (60,000psi). The compliancy of these adhesives allows for the bonding of two materials having large dissimilarities in thermal expansion coefficients (TCEs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features:

  • Fully polymerized resin - No "cure"
  • Easily reworkable - No outgassing
  • Bonds in seconds - Not hours or minutes
  • Low modulus reduces stress to bonded materials

Information provided by Cookson Electronics

Available Properties
  • Modulus of Elasticity
  • Adhesive Bond Strength
  • Volume Resistivity
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Temperature
  • Shelf Life
  • Attatch Temperature
  • Excursion Temperature
  • Filler Material
  
Property Data

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