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Cookson Group POLYSOLDER® LS One Part Electrically Conductive Adhesive Paste

 

Subcategory: Adhesive; Thermoset; Solder/Braze Alloy

Material Notes:
This material is a lead-free, self-fluxing, no clean, environmentally acceptable solder substitute. It is specifically designed for electronic component assembly, especially surface mount. This product can be applied by either pneumatic dispensing or screen print methods, it is then hardened by thermal processing in IR, convection, conduction or vapor phase equipment. This material is a unique electronic polymer that forms stable electrical and mechanical junctions with standard components, even after extended environmental aging.

Features:

  • Pb-Free
  • Intrinsically Clean
  • Fine Pitch
  • Low Stress
  • Stable Junctions
  • Self Fluxing

Information provided by Cookson Electronics

Available Properties
  • Filler Content
  • Viscosity
  • Tensile Strength @ Break
  • Elongation at Break
  • Tensile Modulus
  • Adhesive Bond Strength
  • Adhesive Bond Strength
  • Volume Resistivity
  • CTE, linear 20°C
  • Thermal Conductivity
  • Glass Temperature
  • Pot Life
  • Shelf Life
  • 300C Dry/Cured
  • 300C Wet/Non-Cured
  • Bonding Range
  • Junction Resistivity
  • Peak Load
  • Push Off Strength
  • Thixotropic Index
  
Property Data

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