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GE Advanced Ceramics HCP Boron Nitride (BN) Powder

 

Subcategory: Nitride

Material Notes:
Grade HCP is a fine mesh hexagonal Boron Nitride (BN) powder (99%, -325 mesh). It exhibits the unique properties of boron nitride in a form readily used in the production of many advanced materials. Secondary processing in proprietary, high temperature environment achieves high purity and large, platelet crystals (7-10µ). providing enhanced lubricity and thermal properties. Grade HCP is also available in two additional versions which differ only in terms of their surface area. Grade HCPL is a low surface area, high purity BN powder. Grade HCPH is a high surface area, high purity BN powder.

Boron Nitride powders are produced by GE Advanced Ceramics in more than 50 individual (standard and custom) grades to meet a wide variety of application needs. For use in: Electrically insulating/thermally conductive fillers for heaters, polymer matrices, adhesives, pastes and potting compounds. Lubrication applications for extreme heat or cold, extreme pressure, vacuum environments or harsh chemical exposures. Refractories and refractory coatings. Mold/die release. Metal/ceramic and ceramic/matrix composites.

General Characteristics of Boron Nitride: Electrical Insulator, Low Dielectric Constant, Low Dielectric Loss, High Temperature Stability, Thermal Conductor, Lubricious, Inert, Non-Wetting.

Information provided by GE Advanced Ceramics.

Available Properties
  • Apparent Bulk Density
  • Particle Size
  • Specific Surface Area
  • Color
  • Crystal Structure
   
Property Data

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