GE Advanced Ceramics HCPL Boron Nitride (BN) Powder

Subcategory: Nitride

Material Notes:
All Grade HCP powders are high purity, fine (99%, -325 mesh), hexagonal Boron Nitride (BN). All exhibit the unique properties of BN in a form readily used in many advanced materials and processes. To further customize HCP powders for customers, Advanced Ceramics has developed Grade HCPL, a BN powder with low surface area particles. Grade HCPL is designed for users who find that low surface area powders are advantageous to their processing methods or products. In some processes, HCPL may exhibit improved blend characteristics, higher thermal conductivity, improved chemical stability, and a lower coefficient friction.

Boron Nitride powders are produced by GE Advanced Ceramics in more than 50 individual (standard and custom) grades to meet a wide variety of application needs. For use in: Electrically insulating/thermally conductive fillers for heaters, polymer matrices, adhesives, pastes and potting compounds. Lubrication applications for extreme heat or cold, extreme pressure, vacuum environments or harsh chemical exposures. Refractories and refractory coatings. Mold/die release. Metal/ceramic and ceramic/matrix composites.

General Characteristics of Boron Nitride: Electrical Insulator, Low Dielectric Constant, Low Dielectric Loss, High Temperature Stability, Thermal Conductor, Lubricious, Inert, Non-Wetting.

Information provided by GE Advanced Ceramics.