|   Oxygen-free Copper (OF), UNS C10200, H02 Temper, flat products  Subcategory: Copper Alloy; Nonferrous Metal; Wrought Copper Close Analogs: UNS C10200 - ASTM B48, B133, B152, B187, B272, B370, B432; C103 (UK); CDA 102 OF; CEN CW009A; ISO Cu-OF R1337; JIS C1020 H3100 (sheet, plate) (Japan); QQ-C-576 Key Words: BS C110, C103, ISO Cu-OF R1337, CEN CW009A, oxygen free high conductivity copper (OFHC), CDA 102 OF, ASTM B48, B133, B152, B187, B272, B370, B432, Cu/cl NF A53301, C1020 H3100, C1020 H3140, flat products, plates, sheets, strips, QQ-C-576 Material Notes: Copper content in composition table includes silver (minimum 99.95% Cu+Ag).  Flat test specimen, 1mm thick, H02 temper.
 Applications: busbars, bus conductors, waveguides, hollow conductors, lead-in wires and anodes for vacuum tubes, vacuum seals, transistor components, glass-to-metal seals, coaxial cables, klystrons, microwave tubes, and rectifiers. Processing: Excellent hot and cold workability; good forgeability. Fabricated by bending, coining, coppersmithing, drawing and upsetting, hot forging and pressing, knurling, roll threading, shearing, spinning, swaging, and stamping. Corrosion Resistance: Good to excellent.  Susceptible to galvanic corrosion when coupled with iron, aluminum, magnesium, lead, tin, and zinc.  Good resistance to atmospheric, brackish water, sea water, and non-oxidizing acid corrosion, but avoid heating in oxidizing atmospheres or exposing to oxidizing acids, moist halogens, sulfides, ammonia, or solutions with ammonium ions. 
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    | Available Properties |  
    | DensityHardness, Rockwell BHardness, Rockwell FHardness, HR30TTensile Strength, UltimateTensile Strength, YieldElongation at BreakModulus of ElasticityPoissons RatioFatigue StrengthMachinabilityShear ModulusShear StrengthElectrical ResistivityCTE, linear 20°CCTE, linear 100°CCTE, linear 250°CSpecific Heat CapacityThermal ConductivityMelting PointAnnealing TemperatureHot-Working TemperatureRecrystallization Temperature
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    | Property Data |  
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