Oxygen-free extra-low phosphorus Copper, UNS C10300, H01 temper, flat product

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Oxygen-free extra-low phosphorus Copper, UNS C10300, H01 temper, flat product

Subcategory: Copper Alloy; Nonferrous Metal; Wrought Copper

Close Analogs: UNS C10300, CDA 103, ASTM B133, B152, B187, B272, B432

Key Words: OFXLP, CDA 103, ASTM B133, 152, 187, 272, 432

Material Notes:
Note: Cu percentage includes Cu+Ag+P. Flat test specimen, 1 mm thick.

Applications: electrical conductors and terminals, tubular busbars, commutators, copper clad steel and clad products, waveguide tubing, thermostatic control tubing, and applications requiring good conductivity and welding or brazing properties.

Processing: Excellent hot and cold workability; good forgeability. Annealing temp.: 475-750°C (900-1400°F). Hot working temp.: 750-875°C (1400-1600°F). Fabricated by coining, coppersmithing, drawing and upsetting, hot forging and pressing, spinning, swaging, stamping.

Corrosion Resistance: Good to excellent

Weldability: excellent welding and brazing properties.

Available Properties

Density
Hardness, Rockwell B
Hardness, Rockwell F
Hardness, HR30T
Tensile Strength, Ultimate
Tensile Strength, Yield
Elongation at Break
Modulus of Elasticity
Poissons Ratio
Machinability
Shear Modulus
Shear Strength
Electrical Resistivity
CTE, linear 20°C
CTE, linear 100°C
CTE, linear 250°C
Specific Heat Capacity
Thermal Conductivity
Melting Point
Solidus
Liquidus

Property Data

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