Lucas-Milhaupt HANDY HI-TEMP 095 Carbide Brazing Alloy

Subcategory: Silver Alloy; Copper Alloy; Zinc Alloy; Nonferrous Metal; Solder/Braze Alloy

Material Notes:

Applications:Handy Hi-Temp 095 is a ductile copper-nickel-manganese filler metal designed for intermediate temperature brazing of carbides, cast irons, steel, stainless steels and nickel base heat-resistant alloys. This filler metal is ideally suited for combined brazing/heat-treating. It is useful in the brazing of materials that may be harmed by the higher temperatures used in copper brazing. It also may be used to advantage in the brazing of materials that are subject to erosion and grain-boundary penetration associated with high boron (2 to 5%) brazing filler metals.

Characteristics:This filler metal is relatively free-flowing and will flow into long, narrow joints, except when solution of excessive amounts of nickel raises the liquidus temperature. Preferred joint clearances are in the range of 0.001 to 0.003 in. (3 to 8mm). Fluxless brazing may be accomplished in dry hydrogen or argon of at least -80EF (-62EC) dew point or by vacuum at 10-3 torr or better.

Specifications:This filler metal conforms to the following specification-SAE AMS-4764

Information provided by Lucas-Milhaupt, Inc.