Lucas-Milhaupt FOS FLO 670 Copper Phosphorus Tin Braze Filler Metal

Subcategory: Copper Alloy; Nonferrous Metal; Solder/Braze Alloy

Material Notes:

Applications:Fos-Flo 7 iFos-Flo 670 is a low cost brazing filler metal suitable for joining copper to copper and copper to copper alloys where critical impact or vibration stresses are not encountered in service. It should only be used on assemblies where good fitup can be maintained.

Characteristics: Fos-Flo 670 is a copper rich, low temperature, brazing filler metal that is free flowing and self-fluxing on copper by virtue of its phosphorus content. This alloy is extremely fluid when heated rapidly to its flow point and will penetrate joints with very little clearance. Best results are obtained with joint clearances of .001-.003 in. (.025 mm - .075 mm).

The self-fluxing property of Flo Flo 670 is effective on copper only. Copper base alloys, such as brass or bronze, may be brazed with Fos Flo 670 if the joints are coated with Handy Flux. Fos Flo 670 should not be used on ferrous metals or nickel base alloys, since the phosphorus produces brittle iron or nickel phosphides at the joint interface.

Information provided by Lucas-Milhaupt, Inc.