Overview - Epoxy, Encapsulating, Glass Filled
Subcategory: Epoxy; Thermoset; Polymer
Close Analogs: Click button for specific proprietary grades that belong to this Overview class.
Please be aware that some proprietary polymers may not be listed because they fall into more than one class or because of ambiguity in manufacturer's information.
Key Words: Plastics, Polymers
Available Properties |
- Density
- Apparent Bulk Density
- Water Absorption
- Linear Mold Shrinkage
- Hardness, Barcol
- Tensile Strength, Ultimate
- Tensile Strength, Yield
- Elongation at Break
- Tensile Modulus
- Flexural Modulus
- Flexural Yield Strength
- Compressive Yield Strength
- Izod Impact, Notched
- Electrical Resistivity
- Surface Resistance
- Dielectric Constant
- Dielectric Constant, Low Frequency
- Dielectric Strength
- Dissipation Factor
- Dissipation Factor, Low Frequency
- Arc Resistance
- CTE, linear 20°C
- CTE, linear 20°C Transverse to Flow
- Thermal Conductivity
- Maximum Service Temperature, Air
- Deflection Temperature at 1.8 MPa (264 psi)
- Glass Temperature
- UL RTI, Electrical
- UL RTI, Mechanical with Impact
- UL RTI, Mechanical without Impact
- Flammability, UL94
- Oxygen Index
- Processing Temperature
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Property Data |
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