Chevron Phillips Oxygen-Scavenging Polymer OSP500R EMCM Resin

Subcategory: Thermoplastic

Material Notes:
Ethylene Methyl Acrylate Cyclohexene Methyl Acrylate (EMCM) is a polymer that will oxidize but not degrade. CHMA content 14.0% (wt.). Primary antioxidant 150 ppm. Oxygen capacity 65 cc/gm.

OSP500R is designed for use in coextruded blown film applications at gauges of 0.25 mil to 1.5 mil of a non-food contact layer.  This resin should be blended with one of the Catalyst/Photoinitiator Masterbatches in order to properly activate the oxygen scavenging mechanism. Typical blend ratios range from 95:5 to 85:15 (EMCM/MB) with 90:10 being the recommended blend ratio for most applications. Recommended extrusion melt temperatures range from 250°F to 400°F when blended with OSP100M Masterbatch. Higher melt temperature extrusion of up to 550°F is possible when blending with OSP150M.

OSP polymers are used in packaging for O₂-sensitive applications from food to electronics. Packaging produced with OSP polymers can extend product life, eliminating waste and providing greater distribution flexibility. Oxygen scavenging rates and capacities are influenced significantly by UV activation dose, use conditions such as storage temperatures, and initial package oxygen content.

Information provided by Chevron Phillips Chemical Company.