Cookson Group Plaskon® 3300S Mineral Filled Novolac Epoxy Molding Compound
Subcategory: Epoxy; Thermoset; Polymer
Material Notes: Data Provided by the manufacturer, Plaskon Division (Amoco Electronic Materials). The Plaskon division was sold to the Cookson Group, 1999. Test specimens were transfer molded and post cured 4 hours at 175°C. A low stress, flame retardant, novolac hardened epoxy molding compound designed to provide hermeticity protection exceeding that of PLASKON's 3200 series encapsulants.
Available Properties |
- Density
- Spiral Flow
- Hardness, Shore D
- Tensile Strength, Ultimate
- Flexural Yield Strength
- Dielectric Constant
- Dielectric Constant, Low Frequency
- Dielectric Strength
- Dissipation Factor
- Dissipation Factor, Low Frequency
- Arc Resistance
- CTE, linear 20°C
- CTE, linear 20°C Transverse to Flow
- Thermal Conductivity
- Glass Temperature
- Flammability, UL94
- Processing Temperature
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Property Data |
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