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Cookson Group Plaskon® 7090 Epoxy Molding Compound

 

Subcategory: Epoxy; Thermoset

Material Notes:
Data Provided by the manufacturer, Plaskon Division (Amoco Electronic Materials). The Plaskon division was sold to the Cookson Group, 1999. Test specimens were transfer molded and post cured 4 hours at 175°C.

A reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs, and SOICs. Excellent moldability (ease of filling, good release, minimal flash and bleed and good hot hardness); Superior cosmetics; Improved markability; Outstanding device reliability

Available Properties
  • Density
  • Viscosity
  • Linear Mold Shrinkage
  • Spiral Flow
  • Hardness, Shore D
  • Flexural Modulus
  • Flexural Yield Strength
  • Dielectric Constant
  • Dielectric Constant, Low Frequency
  • Dielectric Strength
  • Dissipation Factor
  • Dissipation Factor, Low Frequency
  • Arc Resistance
  • CTE, linear 20°C
  • CTE, linear 20°C Transverse to Flow
  • Thermal Conductivity
  • Glass Temperature
  • Flammability, UL94
  • Processing Temperature
   
Property Data

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