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Cookson Group Plaskon® LS-16 Molding Compound

 

Subcategory: Thermoset

Material Notes:
Data Provided by the manufacturer, Plaskon Division (Amoco Electronic Materials). The Plaskon division was sold to the Cookson Group, 1999. Test specimens were transfer molded and post cured 4 hours at 175°C.

A low stress molding compound specifically formulated for use with automated molding equipment to increase semiconductor manufacturing productivity and reduce production costs; recommended for molding of stress sensitive DIPs, SOICs, PLCCs & small QFPs. Consistent, expedient moldability; Broad range of molding temperatures; Fast cycle times; Low viscosity; Minimal, if any, post mold cure; Low stress

Available Properties
  • Density
  • Viscosity
  • Spiral Flow
  • Hardness, Shore D
  • Flexural Modulus
  • Flexural Yield Strength
  • Electrical Resistivity
  • Dielectric Constant
  • Dielectric Constant, Low Frequency
  • Dielectric Strength
  • Dissipation Factor
  • Dissipation Factor, Low Frequency
  • Arc Resistance
  • CTE, linear 20°C
  • CTE, linear 20°C Transverse to Flow
  • Thermal Conductivity
  • Glass Temperature
  • Flammability, UL94
  • Processing Temperature
   
Property Data

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