Cookson Group Plaskon® LS-16S Molding Compound
Subcategory: Thermoset
Material Notes: Data Provided by the manufacturer, Plaskon Division (Amoco Electronic Materials). The Plaskon division was sold to the Cookson Group, 1999. Test specimens were transfer molded and post cured 4 hours at 175°C. A low stress molding compound specifically formulated for use with conventional molding equipment to increase semiconductor manufacturing productivity and reduce production costs; recommended for molding of stress sensitive DIPs, SOICs, PLCCs & small QFPs Consistent, expedient moldability; Fast cycle times; Low viscosity; Minimal, if any, post mold cure; Low stress
Available Properties |
- Density
- Viscosity
- Spiral Flow
- Hardness, Shore D
- Flexural Modulus
- Flexural Yield Strength
- Electrical Resistivity
- Dielectric Constant
- Dielectric Constant, Low Frequency
- Dielectric Strength
- Dissipation Factor
- Dissipation Factor, Low Frequency
- Arc Resistance
- CTE, linear 20°C
- CTE, linear 20°C Transverse to Flow
- Thermal Conductivity
- Glass Temperature
- Flammability, UL94
- Processing Temperature
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Property Data |
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