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Cookson Group Plaskon® S-7S Epoxy Encapsulant

 

Subcategory: Epoxy; Thermoset

Material Notes:
Data Provided by the manufacturer, Plaskon Division (Amoco Electronic Materials). The Plaskon division was sold to the Cookson Group, 1999. Test specimens were transfer molded and post cured 4 hours at 175°C.

A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically formulated to provide a lower viscosity for those low stress applications where wire sweep may be a concern. Excellent low stress properties; Consistent moldability (low viscosity, easy of mold filling, fast cycles and good hot hardness); Outstanding cosmetics and markability; Superior reliability

Available Properties
  • Density
  • Viscosity
  • Linear Mold Shrinkage
  • Spiral Flow
  • Hardness, Shore D
  • Tensile Strength, Ultimate
  • Flexural Modulus
  • Flexural Yield Strength
  • Dielectric Constant
  • Dielectric Constant, Low Frequency
  • Dielectric Strength
  • Dissipation Factor
  • Dissipation Factor, Low Frequency
  • Arc Resistance
  • CTE, linear 20°C
  • CTE, linear 20°C Transverse to Flow
  • Thermal Conductivity
  • Glass Temperature
  • Flammability, UL94
  • Processing Temperature
   
Property Data

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