Cookson Group Plaskon® SMT-B-1™ Epoxy Molding Compound for PBGAs
Subcategory: Epoxy; Thermoset
Material Notes: Data Provided by the manufacturer, Plaskon Division (Amoco Electronic Materials). The Plaskon division was sold to the Cookson Group, 1999. Test specimens were transfer molded and post cured 4 hours at 175°C. An epoxy molding compound optimized specifically for grid arrays (BGA/LGA). It is formulated with a unique resin system that minimizes warpage and enables trouble-free molding onto laminated substrates. Minimal warpage (after post bake and solder treatment); Outstanding high temperature flexural strength; Low stress; Excellent moldability (low viscosity)
Available Properties |
- Density
- Viscosity
- Spiral Flow
- Hardness, Shore D
- Flexural Modulus
- Flexural Yield Strength
- Electrical Resistivity
- Dielectric Constant
- Dielectric Constant, Low Frequency
- Dielectric Strength
- CTE, linear 20°C
- CTE, linear 20°C Transverse to Flow
- Thermal Conductivity
- Glass Temperature
- Flammability, UL94
- Processing Temperature
|
|
|
|
Property Data |
This page displays only the text
of a material data sheet.
To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
etc), please click the button below. |
|
|
|
|