Cookson Group Plaskon® SMT-B-1FX (146.801) Epoxy Molding Compound for PBGAs
Subcategory: Epoxy; Thermoset
Material Notes: Data Provided by the manufacturer, Plaskon Division (Amoco Electronic Materials). The Plaskon division was sold to the Cookson Group, 1999. Test specimens were transfer molded and post cured 4 hours at 175°C. An epoxy molding compound optimized specifically for PBGA applications. It is a reduced catalyst version of SMT-B-1F and provides a 1-2% wire sweep improvement in most applications. It has the same unique resin system as that in SMT-B-1. Faster cure speed for shorter cure times in multi-plunger and automolding equipment; Improved wire sweep performance (lower viscosity); Reduced post mold cure times; Improved warp performance; Lower moisture absorption
Available Properties |
- Density
- Viscosity
- Spiral Flow
- Hardness, Shore D
- Flexural Modulus
- Flexural Yield Strength
- Electrical Resistivity
- Dielectric Constant
- Dielectric Constant, Low Frequency
- Dielectric Strength
- CTE, linear 20°C
- CTE, linear 20°C Transverse to Flow
- Thermal Conductivity
- Glass Temperature
- Flammability, UL94
- Processing Temperature
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Property Data |
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