Cookson Group Plaskon® SMT-B-1RC (146.403) Epoxy Molding Compound for PBGAs

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Cookson Group Plaskon® SMT-B-1RC (146.403) Epoxy Molding Compound for PBGAs

Subcategory: Epoxy; Thermoset

Material Notes:
Data Provided by the manufacturer, Plaskon Division (Amoco Electronic Materials). The Plaskon division was sold to the Cookson Group, 1999. Test specimens were transfer molded and post cured 4 hours at 175°C.

An epoxy molding compound optimized specifically for PBGA applications. It has the same unique resin system as SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Faster cure speed for shorter cure times in multi-plunger and automolding equipment; Improved wire sweep performance (lower viscosity); Reduced post mold cure times; Improved warp performance

Available Properties

Density
Viscosity
Spiral Flow
Hardness, Shore D
Flexural Modulus
Flexural Yield Strength
Electrical Resistivity
Dielectric Constant
Dielectric Constant, Low Frequency
Dielectric Strength
CTE, linear 20°C
CTE, linear 20°C Transverse to Flow
Thermal Conductivity
Glass Temperature
Flammability, UL94
Processing Temperature

Property Data

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