Aptek DIS-A-PASTE 2000-A/B Thermally conductive urethane adhesive
Subcategory: Adhesive; Polyurethane, TS; Thermoset
Material Notes: DIS-A-PASTE 200-A/B is a two component, mineral filled, electrically insulating soft urethane paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. DIS-A-PASTE 2000-A/B is a 100% solid, solvent free system that will not form voids during cure or outgas after being fully cured. This product is a non-TDI based urethane system which has reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry. DIS-A-PASTE 2000-A is an off-white, mineral filled polyol resin. DIS-A-PASTE 2000-B is a clear yellow, organic isocyanate. Information provided by Aptek Laboratories, Inc.
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