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Aptek DIS-A-PASTE 2001-PMF Thermally conductive urethane adhesive


Subcategory: Adhesive; Polyurethane, TS; Thermoset

Material Notes:
Premixed-frozen, thermally conductive urethane adhesive
DIS-A-PASTE 2001-PMF is a one component, premixed-frozen, mineral filled, and off-white electrically insulating soft urethane paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. DIS-A-PASTE 2001-PMF is a 100% solid, solvent free system that will not form voids during cure or outgas after being fully cured. This product is a non-TDI based urethane system which has reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry.

Premixed-frozen and packaged in syringes for convenient dispensing to circuit board. Low modulus to minimize stress to sensitive components and ceramic substrates. Low Tg for excellent low temperature cycling and performance. Excellent substrate adhesion; superior to silicones. Bonds DAT-A-THERM 1000 thermally conductive urethane film to devices and substrates without loss of thermal conductivity. Product also available in 8-10 mil. bondline spacers-designated DIS-A-PASTE 2001/.01.

Information provided by Aptek Laboratories, Inc.

Available Properties
  • Density
  • Viscosity
  • Hardness, Shore A
  • Shear Strength
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear 20°C
  • Thermal Conductivity
  • Glass Temperature
  • Flash Point
  • Processing Temperature
Property Data

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