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Aptek DIS-A-PASTE 2003-A/B Thermally conductive urethane adhesive

 

Subcategory: Adhesive; Polyurethane, TS; Thermoset

Material Notes:
Long work life, thermally conductive urethane adhesive
DIS-A-PASTE 2003-A/B is a two component, mineral filled, electrically insulating soft urethane paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. DIS-A-PASTE 2003A/B is a 100% solid, solvent free system that will not form voids during cure or outgas after being cured. This product is a non-TDI based urethane system which has reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry.

Low modulus/high elongation for minimum stress to sensitive components and ceramic substrates. Low Tg for excellent low temperature cycling and performance. Excellent substrate adhesion; superior to silicones. Exceeds NASA outgassing requirements for high vacuum environments. Bonds DAT-A-THERM 1000 film to devices and substrates without loss of thermal conductivity. Available in pre-mixed frozen syringes. Product also available in 8-10 mil. bondline spacers-designated DIS-A-PASTE 2003A-.010/B.

DIS-A-PASTE 2003-A is an off-white, mineral filled polyol resin. DIS-A-PASTE 2003-B is a clear, organic isocyanate.

Information provided by Aptek Laboratories, Inc.

Available Properties
  • Density
  • Viscosity
  • Outgassing - Total Mass Loss
  • Collected Volatile Condensable Material
  • Hardness, Shore A
  • Tensile Strength, Ultimate
  • Elongation at Break
  • Shear Strength
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear 20°C
  • Thermal Conductivity
  • Glass Temperature
  • Flash Point
  • Processing Temperature
   
Property Data

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