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Aptek 2312-PMF Electrically conductive, low modulus adhesive

 

Subcategory: Adhesive; Thermoset

Material Notes:
Premixed-frozen, electrically conductive, low modulus adhesive
APTEK 2312-PMF is a one component, premixed-frozen, silver filled, electrically conductive soft paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. APTEK 2312-PMF is a 100% solid, solvent free system that will not form voids during cure or outgas after being fully cured.

Premixed-frozen and packaged in syringes for convenient dispensing to circuit board; Low modulus to minimize stress to sensitive components and ceramic substrates; Low Tg for excellent low temperature cycling and performance; Excellent substrate adhesion, superior to silicones; Available with spacer beads for precise bond line control

Information provided by Aptek Laboratories, Inc.

Available Properties
  • Density
  • Outgassing - Total Mass Loss
  • Collected Volatile Condensable Material
  • Shear Strength
  • Volume Resistivity
  • Thermal Conductivity
  • Glass Temperature
  • Flash Point
  • Processing Temperature
   
Property Data

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