Aptek 2100-A/B Urethane Encapsulant and/or Potting Compound
Subcategory: Polyurethane, TS; Thermoset
Material Notes: General purpose encapsulant and potting compound. Outstanding hydrolytic stability. Excellent adhesion to components/circuit boards. Low modulus, low stress. Field proven for military and space applications. Part A is a cloudy, unfilled polyol resin. Part B is a clear/hazy yellow organic isocyanate. Information provided by Aptek Laboratories, Inc.
Available Properties |
- Density
- Moisture Absorption at Equilibrium
- Viscosity
- Outgassing - Total Mass Loss
- Collected Volatile Condensable Material
- Hardness, Shore A
- Tensile Strength, Ultimate
- Elongation at Break
- Modulus of Elasticity
- Shear Strength
- Volume Resistivity
- Dielectric Constant
- Dielectric Strength
- Dissipation Factor
- CTE, linear 20°C
- Thermal Conductivity
- Glass Temperature
- Flash Point
- Processing Temperature
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Property Data |
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