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Reltek LLC BONDiT™ B-481 Adhesive, Sealant & Coating System

 

Subcategory: Adhesive; Thermoset; Polymer

Key Words: Epoxy Adhesive, Sealant

Material Notes:
Key Properties:

  • High strength and toughness with excellent thermal stability to 400°F.
  • Outstanding chemical resistance.
  • Excellent electrical, and mechanical properties.
  • Ease of use.

Applications: Encapsule sensitive instrumentation for chemical isolation, outstanding moisture resistance, ruggedness and flexibility. Suitable for clean room use and direct contact with semiconductors. Very easy to use and very clean two-part system. Superior for coating in marine applications and other harsh environments. Tough, high strength, chemically resistant non-blush clear coating with medium gloss finish. Bonds to most substrates. Can be applied to oily surfaces. Ambient 24 hour or accelerated thermal cure.

Available Properties
  • Water Absorption
  • Viscosity
  • Tensile Strength, Ultimate
  • Tensile Strength @ Break
  • Tensile Strength @ Yield
  • Elongation at Break
  • Elongation at Yield
  • Tangent Modulus
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Pot Life
  • Chemical & Moisture Resistance
  • Color
   
Property Data

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