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Reltek LLC BONDiT™ A-3 Bonding Agent, Primer and Adhesive

 

Subcategory: Adhesive; Thermoset

Key Words: Epoxy Adhesive, Sealant

Material Notes:
Key Properties:

  • Adhesion promoter and primer for coatings, sealants and adhesives on metals, glass and ceramic.
  • Exceptional moisture and high pH resistance.
  • Outstanding harsh environment protection and cathodic corrosion protection when used with the B-4811.

Applications: Exceptional corrosion and chemical protection. Promotes adhesion and provides primer protection on most metals, ceramic and glass (including sapphire), most elastomers (including silicon) and low surface energy substrates. Functional for a wide range of overmold materials, paints, coatings, encapsulates. High thermal stability (250°C) and chemical resistance. Suitable for bonding semiconductor material. Used as adhesive for very thin bond lines (½ mil) such as for glass-to-glass and glass-to-polyethylene bonding. Compatible for use with BONDiT B-4X epoxy series. Ambient cure 60 min or accelerated thermal cure. Water white to slight amber.

Available Properties
  • Specific Gravity
  • Viscosity Measurement
  • Maximum Service Temperature, Air
  • Refractive Index
  • Cure Time
  • Color
   
Property Data

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