Aremco Aremco-Bond™ 855 Epoxy Adhesive
Subcategory: Epoxy; Adhesive; Thermoset
Material Notes: High performance epoxy for specialty bonding and potting applications to 350 ºF (175 °C). Can be applied to a myriad of substrates, offering exceptional chemical, electrical, and mechanical properties. General purpose, low viscosity, electrical potting compound. Low shrinkage and excellent dimensional stability. Data provided by the manufacturer, Aremco Products, Inc. Aremco Products, Inc. makes no warranty express or implied concerning the use of these products. The user assumes all risk of use or handling whether or not in accordance with directions or suggestions, or used singly or in combination with other products.
Available Properties |
- Density
- Viscosity
- Shear Strength
- Electrical Resistivity
- Dielectric Constant
- Dielectric Strength
- Dissipation Factor
- CTE, linear 20°C
- Thermal Conductivity
- Maximum Service Temperature, Air
|
|
|
|
Property Data |
This page displays only the text
of a material data sheet.
To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
etc), please click the button below. |
|
|
|
|