AREMCO Aremco-Bond™ 805 High Performance Epoxides
Subcategory: Epoxy; Adhesive; Thermoset
Material Notes: Aluminum-Filled, Low Shrinkage, High Thermal Conductivity, For Bonding and Molding ApplicationsInformation provided by AREMCO
Available Properties |
- Specific Gravity
- Viscosity
- Hardness, Shore D
- Flexural Strength
- Shear Strength
- Volume Resistivity
- Dielectric Strength
- CTE, linear 68°F
- Thermal Conductivity
- Maximum Service Temperature, Air
- Minimum Service Temperature, Air
- Shrinkage
- Cure Time
- Pot Life
- Chemical Resistance
- Mix Ratio by Weight
|
|
|
|
Property Data |
This page displays only the text
of a material data sheet.
To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
etc), please click the button below. |
|
|
|
|