Hexion MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength
Subcategory: Melamine; Phenolic; Thermoset
Close Analogs: Bakelite AG has become Hexion Specialty Chemicals GmbH in 2005. The status of this product is unknown.
Material Notes: Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not listed). Application areas: Commutators (fuel pumps, actuators, HVAC motors, fan motors, window lift motors, ABS, wiper motors, garden appliances, household appliances, power tools, universal motors) Information provided by Bakelite AG
Available Properties |
- Density
- Apparent Bulk Density
- Linear Mold Shrinkage
- Ball Indentation Hardness
- Tensile Strength at Break
- Tensile Modulus
- Flexural Modulus
- Flexural Strength
- Compressive Strength
- Charpy Impact Unnotched
- Charpy Impact, Notched
- Volume Resistivity
- Surface Resistance
- Dielectric Constant
- Dielectric Strength
- Dissipation Factor
- Comparative Tracking Index
- Maximum Service Temperature, Air
- Deflection Temperature at 8.0 MPa
- Shrinkage
- Feed Temperature
- Nozzle Temperature
- Melt Temperature
- Mold Temperature
- Injection Pressure
- Back Pressure
- Cure Time
- Holding Pressure
- Moisture Absorption
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Property Data |
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