Hexion PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties

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Hexion PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties

Subcategory: Phenolic; Thermoset; Polymer

Close Analogs: Bakelite AG has become Hexion Specialty Chemicals GmbH in 2005. The status of this product is unknown.

Material Notes:
Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.

Application areas: Parts for electrical and telecommunications technology, car electronics, terminal boards and base plates, housings, mounting parts, motor ignition systems.

Information provided by Bakelite AG

Available Properties

Density
Apparent Bulk Density
Linear Mold Shrinkage
Ball Indentation Hardness
Flexural Modulus
Flexural Strength
Charpy Impact Unnotched
Charpy Impact, Notched
Volume Resistivity
Surface Resistance
Dielectric Constant
Dielectric Strength
Dissipation Factor
Comparative Tracking Index
Maximum Service Temperature, Air
Deflection Temperature at 8.0 MPa
Shrinkage
Feed Temperature
Nozzle Temperature
Melt Temperature
Mold Temperature
Injection Pressure
Back Pressure
Cure Time
Chromatic Spectrum
Creep Rupture Strength
Holding Pressure
Media Resistance
Moisture Absorption
Reserves by Peak Temperature
Thermal Expansion

Property Data

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