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Bulk Molding Compounds BMC 945 Conductive Grade Bulk Molding Compound

 

Subcategory: Polyester, TS; Thermoset

Material Notes:
BMC 945 is an ESD level Conductive grade of Bulk Molding Compound and is suitable for compression, transfer and stuffer injection molding. It is characterized by excellent flow and controlled reactivity and is well suited for injection molding.

Typical applications may include electronic enclosures, computer chip trays and storage boxes, and other applications requiring ESD level conductivity.

Available Properties
  • Specific Gravity
  • Water Absorption
  • Linear Mold Shrinkage
  • Hardness, Barcol
  • Tensile Strength, Ultimate
  • Flexural Modulus
  • Flexural Strength
  • Compressive Strength
  • Izod Impact, Notched
  • Surface Resistivity per Square
  • Deflection Temperature at 1.8 MPa (264 psi)
  • Glass Temperature
  • Flammability, UL94
  • Mold Temperature
  
Property Data

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