CHOMERICS CHO-BOND® 584-29 Conductive Adhesive
Subcategory: Thermoset; Polymer
Material Notes: Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the material is offered in convenient premeasured "CHO-PAK" for rapid application.Information provided by Chomerics
Available Properties |
- Specific Gravity
- Shear Strength
- Volume Resistivity
- CTE, linear 20°C
- Thermal Conductivity
- Maximum Service Temperature, Air
- Minimum Service Temperature, Air
- Cure Time
- Pot Life
- Shelf Life
- Color
- Consistency
- Mix Ratio
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Property Data |
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