CHOMERICS CHO-BOND® 4660 Conductive Caulk/Sealant
Subcategory: Thermoset; Polymer
Material Notes: CHO-BOND® 4660 caulking compound is a single-component, electrically conductive, paste-like material intended for EMI shielding and grounding applications. Its non-hardening characteristic makes it particularly suited for shielding joints and seams which are likely to be disassembled, or joints subject to vibrations, warping, or temperature induced displacement.Information provided by Chomerics
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