Cytec (Conap) RN-1210 / EA-87 Conapoxy® Resin / Conacure® Hardener
Subcategory: Epoxy; Adhesive; Thermoset
Material Notes:
Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) RN-1210 / EA-87 Conapoxy® Resin / Conacure® Hardener Filled version of RN-1200 with lower shrinkage, improved thermal properties and lower coefficient of expansion.
- Mix Ratio, Resin/Hardener (by weight): 100/18.5
Cure Type: Room Temperature
Available Properties |
- Viscosity
- Hardness, Shore D
- Volume Resistivity
- Dielectric Constant
- Dielectric Strength
- Dissipation Factor
- Maximum Service Temperature, Air
- Cure Time
- Pot Life
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Property Data |
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