Emerson & Cuming 2754 Stycast® Two-Component Epoxy Flexible Low-Stress Encapsulant
Subcategory: Epoxy; Adhesive; Thermoset
Material Notes: Emerson & Cuming 2754 Stycast® Two-Component Epoxy Flexible Low-Stress Encapsulant Description
Electronic embedment and sealing of metals, ceramics, and plastics. Protection of stress sensitive components where shock and impact resistance are required. Typical applications include transformers, motors, coils, and other electrical devices
Features- Thermally Conductive
- Good Chemical Resistance
- Filled
- Mix Ratio (by weight) = 100:40
Cure Type: Room Temp or Heat Bonding Type: Epoxy
Available Properties |
- Density
- Viscosity
- Hardness, Shore A
- Dielectric Constant
- Dielectric Strength
- Thermal Conductivity
- Maximum Service Temperature, Air
- Minimum Service Temperature, Air
- Cure Time
|
|
|
|
Property Data |
This page displays only the text
of a material data sheet.
To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
etc), please click the button below. |
|
|
|
|