Emerson & Cuming E-1000 Stycast® One-Component Epoxy Low Stress Encapsulant
Subcategory: Epoxy; Adhesive; Thermoset
Material Notes: Emerson & Cuming E-1000 Stycast® One-Component Epoxy Low Stress Encapsulant Designed for the encapsulation of a wide range of stress sensitive electronics. They offer excellent performance at low temperatures and provide protection from mechanical shock and vibration. Low viscosity, good chemical resistance. Mix Ratio (by weight) = 100:120 Cure Type: Heat Bonding Type: Epoxy
Available Properties |
- Density
- Viscosity
- Hardness, Shore A
- Dielectric Constant
- Dielectric Strength
- Maximum Service Temperature, Air
- Minimum Service Temperature, Air
- Glass Temperature
- Cure Time
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Property Data |
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