Emerson & Cuming 4952/25 Stycast® Two-Component Silicone High Service Temp Encapsulant
Subcategory: Silicone; Adhesive; Thermoset
Material Notes:
Features and Typical Applications Ability to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in harsh environments. Typical applications include sensors, transformers, power supplies, and rectifiers.
Emerson & Cuming 4952/25 Stycast® Two-Component Silicone High Service Temp Encapsulant
- Thermally Conductive
- Poor Chemical Resistance
- Filled
- Mix Ratio by Weight = 100:0.4
Cure Type: Room Temp or Heat Bonding Type: Silicone
Available Properties |
- Density
- Viscosity
- Hardness, Shore A
- Dielectric Constant
- CTE, linear 20°C
- Thermal Conductivity
- Maximum Service Temperature, Air
- Minimum Service Temperature, Air
- Cure Time
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Property Data |
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