Emerson & Cuming 4954/25 Stycast® Two-Component Thermally Conductive Encapsulant
Subcategory: Silicone; Adhesive; Thermoset
Material Notes:
Features and Typical Applications: Provide excellent heat dissipation and thermal shock resistance as well as protection from moisture and chemical agents. Typical applications include sensors, transformers, transducers, switches, and other small devices.
Emerson & Cuming 4954/25 Stycast® Two-Component Thermally Conductive Encapsulant
- Mix Ratio by weight = 100:0.4
- Poor Chemical Resistance
- Filled
- High temperature
Cure Type: Room Temp or Heat Bonding Type: Silicone
Available Properties |
- Density
- Viscosity
- Hardness, Shore A
- Dielectric Constant
- Dielectric Strength
- CTE, linear 20°C
- Thermal Conductivity
- Maximum Service Temperature, Air
- Minimum Service Temperature, Air
- Cure Time
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Property Data |
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