Emerson & Cuming 2851FT Stycast® One-Component Thermally Conductive Encapsulant
Subcategory: Epoxy; Adhesive; Thermoset
Material Notes:
Features and Typical Applications: Provide excellent heat dissipation and thermal shock resistance as well as protection from moisture and chemical agents. Typical applications include sensors, transformers, transducers, switches, and other small devices.
Emerson & Cuming 2851FT Stycast® One-Component Thermally Conductive Encapsulant
- Excellent Chemical Resistance
- Filled
- High temperature
Cure Type: Heat Bonding Type: Epoxy
Available Properties |
- Density
- Viscosity
- Hardness, Shore D
- Dielectric Constant
- CTE, linear 20°C
- Thermal Conductivity
- Maximum Service Temperature, Air
- Minimum Service Temperature, Air
- Cure Time
|
|
|
|
Property Data |
This page displays only the text
of a material data sheet.
To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
etc), please click the button below. |
|
|
|
|