GE Silicones SilCool™ LTR3291 Low Thermal Resistance Silicone Adhesive

Subcategory: Silicone; Thermoset; Polymer

Close Analogs:

GE Silicones became a part of Momentive Performance Materials in 2006.

Material Notes:
SilCoolTM LTR3291 silicone adhesive is a one-component, medium viscosity, thermally conductive material, that will remain in a liquid, uncured state at room temperature, curing to an elastomer when sufficient heat is applied.

SilCool LTR3291 silicone adhesive provides much higher thermal conductivity than conventional silicone adhesives; making it suitable for use in electrical and electronic applications where thermal management and high heat transfer is critical. Utilizing a specially developed filler technology, SilCool LTR3291 is capable of achieving a reduced bond line thickness and has very low thermal resistance values. It is non-corrosive to metals and has excellent adhesive properties to a wide variety of substrates, including ceramics, glass, and most metals, including aluminum, copper and nickel plate. In addition, it also offers excellent adhesion to a broad range of high performance thermoplastics, such as PPS and PBT.

Key Performance Properties:

• Excellent thermal conductivity properties
• Very low thermal resistance
• Reduced bond line thickness capability (< 2 mils)
• Heat accelerated cure, one component, to increase productivity
• Primerless adhesion eliminates mechanical fastening
• Outstanding long-term performance under high humidity