GE Silicones SilCool™ LTR3292 Low Thermal Resistance Silicone Adhesive
Subcategory: Silicone; Thermoset; Polymer
Close Analogs: GE Silicones became a part of Momentive Performance Materials in 2006.
Material Notes: SilCool LTR3292 silicone adhesive is a one-component, low viscosity, thermally conductive material, which will remain in a liquid, uncured state at room temperature and cures to an elastomer when heat is applied. SilCool LTR3292 silicone adhesive provides much higher thermal conductivity than conventional silicone adhesives; making it suitable for use in electrical and electronic applications where thermal management & high heat transfer is critical. Utilizing a specially developed filler technology, SilCool LTR3292 is capable of achieving a reduced bond line thickness and has very low thermal resistance values. It is non-corrosive to metals and has excellent adhesive properties to a wide variety of substrates, including ceramics, glass, and most metals, including aluminum, copper and nickel plate. In addition, it also offers excellent adhesion to a broad range of high performance thermoplastics, such as PPS and PBT. Key Performance Properties: - Excellent thermal conductivity properties
- Very low thermal resistance
- Reduced bond line thickness capability (< 2 mils)
- Heat accelerated cure, one component, to increase productivity
- Primerless adhesion eliminates mechanical fastening
- Outstanding long-term performance under high humidity
Available Properties |
- Specific Gravity
- Viscosity
- Brookfield Viscosity
- Hardness, Shore A
- Tensile Strength at Break
- Elongation at Break
- Adhesive Bond Strength
- Volume Resistivity
- Dielectric Constant
- Dielectric Strength
- Dissipation Factor
- Thermal Conductivity
- Color
- Consistency
- Ionic content
- Thermal Resistance
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Property Data |
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