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GE Silicones TSE326 High Temperature, Heat Cured One Component Silicone Adhesive

 

Subcategory: Silicone; Thermoset; Polymer

Close Analogs:

GE Silicones became a part of Momentive Performance Materials in 2006.

Material Notes:
TSE326 is a one-component, heat curing silicone adhesive which offers extended performance at temperatures exceeding 200C. A flowable material with primerless adhesion to many substrates, it is suitable for assembly and gasketing where a flowable consistency is required. TSE 326 requires a minimum cure temperature of 100C and offers very low linear shrinkage and an improved thermal conductivity of 0.29 W/m K. Reddish brown in color.

Key Performance Properties:

  • One component product-no mixing required
  • Fast cure at elevated temperatures
  • Primerless adhesion to many types of substrates
  • Low linear shrinkage
  • Excellent heat resistance
  • Outstanding dielectric properties

Available Properties
  • Specific Gravity
  • Viscosity
  • Hardness, Shore A
  • Tensile Strength, Ultimate
  • Elongation at Break
  • Adhesive Bond Strength
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear 20°C
  • Cure Time
  • Color
   
Property Data

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