GE Silicones TSE3261-G Heat Resistant Silicone Adhesive

Subcategory: Silicone; Thermoset; Polymer

Close Analogs:

GE Silicones became a part of Momentive Performance Materials in 2006.

Material Notes:
TSE3261-G is a one-component heat curable silicone adhesive designed for high temperature applications. TSE3261-G adheres well to a variety of substrates such as metals, plastics, ceramics and glass without the use of a primer.

Cured properties for specimen cured 1 hour at 150°C.

Key Performance Properties:

• Ready to use - one component
• Excellent high temperature resistance
• Heat accelerated cure
• Excellent adhesive properties; primerless adhesion to many types of substrates
• Gray color
• Non corrosive to metals

Applications:

• Sealing and bonding for high temperature applications
  • Heaters
  • Steam Irons
  • Microwave Ovens
• Sealing, bonding and potting for electrical appliances and electronic parts.

  Available Properties Specific Gravity Viscosity Hardness, Shore A Tensile Strength at Break Elongation at Break Adhesive Bond Strength Volume Resistivity Dielectric Constant Dielectric Strength Dissipation Factor Thermal Conductivity Color Consistency

  Property Data This page displays only the text of a material data sheet. To see MatWeb's complete data sheet for this material (including material property data, metal compositions, material suppliers, etc), please click the button below.