GE Silicones TSE3281G Thermally Conductive, Heat Cured Silicone Adhesive

Subcategory: Silicone; Thermoset; Polymer

Close Analogs:

GE Silicones became a part of Momentive Performance Materials in 2006.

Material Notes:
TSE3280G and TSE3281G silicone adhesives are one component, medium viscosity, thermally conductive materials which remain in an uncured state at room temperature and cure to an elastomer when heat is applied.

TSE3280G and TSE3281G silicone adhesives provide much higher thermal conductivity than conventional silicone adhesives which make them ideal for electrical and electronic applications where high thermal transfer is required. They are non-corrosive and have excellent adhesion properties to a wide variety of substrates without the need for using a primer.

Mechanical, electrical, and thermal properties for specimen cured 1 hour at 150°C.

Key Performance Properties:

• Excellent thermal conductivity properties
• Fast thermal cure times
• Excellent adhesion to many substrates without the use of a primer
• Outstanding operating temperature performance (-55C to 200C, -67F to 392F)
• One component, solventless formulation for ease of handling
• No cure by-products / low shrinkage / non-exothermic allows for deep section application and use in enclosed assemblies
• Reversion resistant and hydrolytically stable
• Outstanding dielectric properties