GE Silicones TSE3282-G Thermally Conductive Silicone Adhesive

Subcategory: Silicone; Thermoset; Polymer

Close Analogs:

GE Silicones became a part of Momentive Performance Materials in 2006.

Material Notes:
TSE328-G silicone adhesive is a one-component, low viscosity, thermally conductive material, which will remain in an uncured state at room temperature and cure to an elastomer when heat is applied.

TSE3282-G provides much higher thermal conductivity than conventional silicone adhesives, which makes it ideal for electrical and electronic applications where high thermal transfer is required. it is non-corrosive to metals and has excellent adhesive properties to a wide variety of substrates, generally without the need for using a primer. For example, primerless adhesion is typically obtained on metals such as aluminum, copper, and nickel plate, PPS and PBT plastics, ceramics, and glass.

Cured properties for specimen cured for 1 hour at 150°C.

Key Performance Properties:

• Excellent thermal conductivity
• Ready to use - once component
• Heat accelerated cure
• Excellent adhesive properties; this material offers primerless adhesion to many substrates
• Non corrosive to metals