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Plaslok 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound

 

Subcategory: Phenolic; Thermoset; Polymer

Close Analogs: Plaslok Corporation was purchased by Plastics Engineering Company in March 2000. The Plaslok name is no longer used on any products.

Material Notes:
Plaslok 201 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to have an excellent balance of molded properties. The material provides good electrical insulation values and physical properties combined with versatile molding characteristics.

Data provided by Plaslok Corporation.

Available Properties
  • Density
  • Apparent Bulk Density
  • Water Absorption
  • Linear Mold Shrinkage
  • Tensile Strength, Ultimate
  • Flexural Modulus
  • Flexural Yield Strength
  • Compressive Yield Strength
  • Izod Impact, Notched
  • Electrical Resistivity
  • Dielectric Constant
  • Dielectric Constant, Low Frequency
  • Dielectric Strength
  • Dissipation Factor
  • Dissipation Factor, Low Frequency
  • Comparative Tracking Index
  • Deflection Temperature at 1.8 MPa (264 psi)
  • UL RTI, Electrical
  • UL RTI, Mechanical with Impact
  • UL RTI, Mechanical without Impact
  • Flammability, UL94
   
Property Data

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