Plaslok 504 Black (INJ) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound
Subcategory: Phenolic; Thermoset; Polymer
Close Analogs: Plaslok Corporation was purchased by Plastics Engineering Company in March 2000. The Plaslok name is no longer used on any products.
Material Notes: Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical properties, it has found use in a wide variety of wiring device applications.Data provided by Plaslok Corporation.
Available Properties |
- Density
- Apparent Bulk Density
- Water Absorption
- Linear Mold Shrinkage
- Tensile Strength, Ultimate
- Flexural Modulus
- Flexural Yield Strength
- Compressive Yield Strength
- Izod Impact, Notched
- Electrical Resistivity
- Dielectric Constant
- Dielectric Constant, Low Frequency
- Dielectric Strength
- Dissipation Factor
- Dissipation Factor, Low Frequency
- Comparative Tracking Index
- Deflection Temperature at 1.8 MPa (264 psi)
- UL RTI, Electrical
- UL RTI, Mechanical with Impact
- UL RTI, Mechanical without Impact
- Flammability, UL94
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Property Data |
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