Loctite® 3565 High performance epoxy, high Tg and low CTE High Tg Underfill
Subcategory: Adhesive; Thermoset
Material Notes:
COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate. Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.
Loctite® 3565 High performance epoxy, high Tg and low CTE High Tg Underfill A high performance underfill for flip chip devices. Specifically formatted for high reliability, hybrid and MCM applications. Designed for gaps down to 1 mil.
Available Properties |
- Density
- Viscosity
- Tensile Modulus
- CTE, linear 20°C
- Glass Temperature
- Cure Time
- Shelf Life
|
|
|
|
Property Data |
This page displays only the text
of a material data sheet.
To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
etc), please click the button below. |
|
|
|
|